The Seleco Process is the finest selective plating system anywhere. When the job requires a highly efficient and cost effective shielding system, the Seleco Process is the right answer and we are committed to providing the best solutions for your custom plating needs. Over the past 30 years, we have applied our shielding process to hundreds of different products, including cell phones, video equipment, data scanners, farm equipment, handheld gps and gaming devices, and medical related devices of all shapes and sizes.
Our proprietary selective coating process is designed to provide the highest levels of attenuation and consistent application across plastics. Here’s a brief explanation of how we achieve maximum results in three simple steps:
Basecoat Application – The heart of the Seleco Process is the application of it’s foundation, the proprietary technology we use for our basecoat. We apply the waterborne basecoat using conventional HVLP spray technology, and the typical thickness is .5 to 1.5 mils dry.
No Stress – Containing very little in the way of Volatile Organics, Seleco’s basecoat provides virtually no stress on the molded housing or the environment.
Selective Application – The basecoat is the roadmap for selectivity. Plating only occurs on the area of the part which receives the basecoat and the remainder of the part retains its as molded color and appearance. To do this, we engineer custom stainless steel masks and accessories for each project.
Pure Copper Layering – After the basecoat is applied, the next step is the plating process applying a layer of one of the most conductive materials on earth, pure copper. Ranging from very thin (50 micro inches) to much thicker deposits (200 micro inches), the copper is the soul of the Seleco Process. The conductivity of the copper provides the guaranteed shielding effectiveness, and the uniform deposition means uniform shielding effectiveness!
Nickel Protection – Because copper oxidizes when exposed to the atmosphere and this oxidation reduces the conductivity of the copper, a thin layer (+/- 25 micro inches) of nickel metal is deposited over the copper to protect it from oxidation and maintain the effectiveness of the shielding. The nickel protects the copper not only from oxidation but also from corrosion from other environmental factors.
a proven, cost effective shielding solution offering the highest levels of attenuation and conductivity.
Effective, Proven, Engineering Friendly